Carrier head of polishing apparatus and membrane used therein
US11597055B2 · kind B2 · utility
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1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Sep 8, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a membrane and carrier head using the membrane for polishing apparatus. The membrane comprises a first fixing flap extending inwards from the upper part of a side portion, a second fixing flap extending upwards from the upper part of the side portion, wherein the second fixing flap has a first inclined part, a second inclined part and a third extending part of extending upwards whereby a compensation force generated by the inclined parts realize the constant pressing force to the edge of a substrate during a polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.