Conductive adhesive
US11597858B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jul 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.