Die ejector height adjustment
US11600516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2020 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Jan 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.