Screwless semiconductor processing chambers
US11600517B2 · kind B2 · utility
1Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Feb 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.