Patent · US Active

Skip-via proximity interconnect

US11600519B2 · kind B2 · utility

0Cited by

102References

19Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Yann Mignot · Slingerlands, US
Hsueh-Chung Chen · Cohoes, US

Key dates

Filing date	Sep 16, 2019
Grant date	Mar 7, 2023
Priority date	—
Expiry date	Jan 22, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/53209
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming vias and skip vias is provided. The method includes forming a blocking layer on an underlying layer, and forming an overlying layer on the blocking layer. The method further includes opening a hole in the overlying layer that overlaps the blocking layer, and etching past the blocking layer into the underlying layer to form a second hole that is smaller than the hole in the overlying layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.