Jet impingement cooling for high power semiconductor devices
US11600550B2 · kind B2 · utility
1Cited by
1References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2019 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Dec 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A jet impingement cooling assembly for semiconductor devices includes a heat exchange base having an inlet chamber and an outlet chamber. An inlet connection may be in fluid connection with the inlet chamber, while an outlet connection may be in fluid connection with the outlet chamber. A jet plate may be coupled to the inlet chamber, and a jet pedestal may be formed on the jet plate and having a raised surface with a jet nozzle formed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.