Patent · US Active

Sensor device and method of manufacture

US11600559B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

MELEXIS TECHNOLOGIES NV · BE

Inventors

Jian Chen · Baoshan, TW
Appolonius Jacobus Van Der Wiel · Tessenderlo, BE
Laurent Otte · Brussels, BE

Key dates

Filing date	Aug 30, 2019
Grant date	Mar 7, 2023
Priority date	—
Expiry date	Mar 28, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1426
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a sensor device (100) comprises providing (200) a package (102) having a first die-receiving subframe volume (104) separated from a second die-receiving subframe volume (106) by a partition wall (116). An elongate sensor element (120) is disposed (202) within the package (102) so as to bridge the first and second subframe volumes (104, 106) and to overlie the partition wall (116). The elongate sensor element (120) resides substantially in the first subframe volume (104) and partially in the second subframe volume (106). The elongate sensor element (120) is electrically connected within the second subframe volume (106).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.