Antenna-in-package device with chip embedding technologies

US11600902B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ashutosh Baheti · Munich, DE
• EungSan Cho · Torrance, US
• Saverio Trotta · Hersbruck, DE

Key dates

• Filing date: Feb 13, 2020
• Grant date: Mar 7, 2023
• Expiry date: Aug 12, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1421
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device includes: a dielectric substrate; an integrated circuit (IC) die disposed inside an opening of the dielectric substrate, where the IC die is configured to transmit or receive radio frequency (RF) signals; a dielectric material in the opening of the dielectric substrate and around the IC die; a redistribution structure along a first side of the dielectric substrate, where a first conductive feature of the redistribution structure is electrically coupled to the IC die; a second conductive feature along a second side of the dielectric substrate opposing the first side; a via extending through the dielectric substrate, where the via electrically couples the first conductive feature and the second conductive feature; and an antenna at the second side of the dielectric substrate, where the second conductive feature is electrically or electromagnetically coupled to the antenna.