Systems and methods for additive manufacturing for the deposition of metal and ceramic materials
US11603589B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2018 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Oct 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31732
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to systems and methods of additive manufacturing that reduce or eliminates defects in the bulk deposition material microstructure resulting from the additive manufacturing process. An additive manufacturing system comprises evaporating a deposition material to form an evaporated deposition material and ionizing the evaporated deposition material to form an ionized deposition material flux. After forming the ionized deposition material flux, the ionized deposition material flux is directed through an aperture, accelerated to a controlled kinetic energy level and deposited onto a surface of a substrate. The aperture mechanism may comprise a physical, electrical, or magnetic aperture mechanism. Evaporation of the deposition material may be performed with an evaporation mechanism comprised of resistive heating, inductive heating, thermal radiation, electron heating, and electrical arc source heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.