Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
US11605552B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Feb 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide a method of manufacturing an electronic device, where the method comprises mounting a plurality of subpanels to a panel, processing the subpanels as a panel, and removing the plurality of subpanels from the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.