LED array for in-plane optical interconnects
US11605618B2 · kind B2 · utility
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6References
4Claims
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Key dates
| Filing date | Mar 17, 2021 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Jun 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/862
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED array on a sapphire substrate may be mounted on a silicon interconnect chip, with LEDs of the array inserted into holes of waveguides on the silicon interconnect chip. The sapphire substrate and the silicon interconnect chip may both have microbumps for carrying electrical signals to or from the LEDs, and the sapphire substrate and silicon interconnect chip may be bonded together using the microbumps. The LEDs may be configured to preferentially emit light in a lateral direction, for increased coupling of light into the waveguides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.