Cameron Danesh
28Patents
2h-index
8Co-inventors
42Inventor score
Filing activity: Nov 11, 2019 → Mar 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11764878B2 | LED chip-to-chip vertically launched optical communications with optical fiber | Physics | 13 | Active |
| US11916598B2 | Parallel optical communication channels using microLEDs | Electricity | 2 | Active |
| US11728894B2 | Optically-enhanced multichip packaging | Electricity | 1 | Active |
| US12101128B2 | LED chip-to-chip vertically launched optical communications with optical fiber | Physics | 1 | Active |
| US11476942B2 | Coherent fiber bundle parallel optical links | Electricity | 1 | Active |
| US11444065B2 | Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same | Electricity | 1 | Active |
| US11784176B2 | Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same | Electricity | 1 | Active |
| US11824590B2 | Interconnect networks using microLED-based optical links | Electricity | 1 | Active |
| US11791901B2 | Coherent fiber bundle parallel optical links | Electricity | 1 | Active |
| US11677472B2 | Hybrid integration of microLED interconnects with ICs | Electricity | 1 | Active |
| US12034096B2 | Enhanced microLEDs for inter-chip communications | Electricity | 0 | Active |
| US12101122B2 | Hybrid integration of microLED interconnects with ICs | Electricity | 0 | Active |
| US12211828B2 | Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same | Electricity | 0 | Active |
| US12244355B2 | Interconnect networks using microLED-based optical links | Electricity | 0 | Active |
| US12334983B2 | Coherent fiber bundle parallel optical links | Electricity | 0 | Active |
| US12174441B2 | Integration of OE devices with ICS | Electricity | 0 | Active |
| US11605618B2 | LED array for in-plane optical interconnects | Electricity | 0 | Active |
| US11906779B2 | Embedding LEDs with waveguides | Electricity | 0 | Active |
| US12132146B2 | P-type doping in GaN LEDs for high speed operation at low current densities | Electricity | 0 | Active |
| US12242102B2 | Multi-layer planar waveguide interconnects | Physics | 0 | Active |
| US12395247B2 | Coherent fiber bundle parallel optical links | Electricity | 0 | Active |
| US11822138B2 | Integration of OE devices with ICs | Electricity | 0 | Active |
| US11810995B2 | P-type doping in GaN LEDs for high speed operation at low current densities | Electricity | 0 | Active |
| US12395246B2 | Optically-enhanced multichip packaging | Electricity | 0 | Active |
| US11815712B2 | Multi-layer planar waveguide interconnects | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.