Radome with integrated passive cooling
US11605886B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Mar 14, 2023 |
| Priority date | — |
| Expiry date | Feb 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/246
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.