Method and structure for sensors on glass

US11608265B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stephan Pindl · Ergoldsbach, DE
• Carsten Ahrens · Birkenfeld, DE
• Stefan Jost · Munich, DE
• Ulrich Krumbein · Rosenheim, DE

Key dates

• Filing date: Jun 24, 2021
• Grant date: Mar 21, 2023
• Expiry date: Jun 25, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04R19/005
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for providing a semiconductor layer arrangement on a substrate which comprises providing a semiconductor layer arrangement having a functional layer and a semiconductor substrate layer, attaching the semiconductor layer arrangement to a glass substrate layer such that the functional layer is arranged between the glass substrate layer and the semiconductor substrate layer, and removing the semiconductor substrate layer at least partially such that the glass substrate layer substitutes the semiconductor substrate layer as the substrate of the semiconductor layer arrangement.