Laser-releasable bonding materials for 3-D IC applications
US11610801B2 · kind B2 · utility
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Key dates
| Filing date | Jan 20, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Mar 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.