Dummy fill structures
US11610839B2 · kind B2 · utility
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10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2019 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Aug 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.