Transfer printing for RF applications
US11610916B2 · kind B2 · utility
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1References
14Claims
0Family size
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Key dates
| Filing date | May 5, 2020 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Nov 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure for RF applications comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.