Heatsink for co-packaged optical switch rack package
US11612079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2021 |
| Grant date | Mar 21, 2023 |
| Priority date | — |
| Expiry date | Sep 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.