Solid vaporization/supply system of metal halide for thin film deposition
US11613809B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Feb 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a solid vaporization/supply system of metal halide for thin film deposition that reduces particle contamination. The system includes a vaporizable source material container for storing and vaporizing a metal halide and buffer tank coupled with the vaporizable source material container. The vaporizable source material container includes a container main body with a container wall; a lid body; fastening members; and joint members, wherein the container wall is configured to have a double-wall structure composed of an inner wall member and outer wall member, which allows a carrier gas to be led into the container main body via its space. The container wall is fabricated of 99 to 99.9999% copper, 99 to 99.9996% aluminum, or 99 to 99.9996% titanium, and wherein the container main body, the lid body, the fastening members, and the joint members are treated by fluorocarbon polymer coating and/or by electrolytic polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.