Fab management with dynamic sampling plans, optimized wafer measurement paths and optimized wafer transport, using quantum computing
US11615974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2019 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Feb 19, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Systems and methods of optimizing wafer transport and metrology measurements in a fab are provided. Methods comprise deriving and updating dynamic sampling plans that provide wafer-specific measurement sites and conditions, deriving optimized wafer measurement paths for metrology measurements of the wafers that correspond to the dynamic sampling plan, managing FOUP (Front Opening Unified Pod) transport through the fab, transporting wafers to measurement tools while providing the dynamic sampling plans and the wafer measurement paths to the respective measurement tools before or as the FOUPs with the respective wafers are transported thereto, and carrying out metrology and/or inspection measurements of the respective wafers by the respective measurement tools according to the derived wafer measurement paths. Quantum computing resources may be used to solve the corresponding specific optimization problems, to reduce the required time, improve the calculated solutions and improve the fab yield and accuracy of the produced wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.