Patent · US Active

Method for producing a nitride compound semiconductor component

US11616164B2 · kind B2 · utility

0Cited by
4References
20Claims
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Key dates

Filing dateJan 17, 2019
Grant dateMar 28, 2023
Priority date
Expiry dateNov 8, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/815
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing a nitride compound semiconductor component is disclosed. In an embodiment the method includes providing a growth substrate, growing a nucleation layer of an aluminum-containing nitride compound semiconductor onto the growth substrate, growing a tension layer structure for generating a compressive stress, wherein the tension layer structure comprises at least a first GaN semiconductor layer and a second GaN semiconductor layer, and wherein an Al(Ga)N interlayer for generating the compressive stress is disposed between the first GaN semiconductor layer and the second GaN semiconductor layer and growing a functional semiconductor layer sequence of the nitride compound semiconductor component onto the tension layer structure, wherein a growth of the second GaN semiconductor layer is preceded by a growth of a first 3D AlGaN layer on the Al(Ga)N interlayer in such a way that it has nonplanar structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.