Apparatus and method for detecting failure in a mechanical press
US11618231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2018 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor device is located between a first die-set part and a second die-set part of a press, and the first and second die-set parts are moved relative to each other for punching and shaping the semiconductor device therebetween. At least one parameter is monitored with at least one sensor attached to the first die-set part and/or the second die-set part at different positions of the first die-set part when it is moving relative to the second die-set part. Variations of the at least one parameter at different relative positions of the first and second die-set parts are compared, and a failure is determined to have occurred when the present variation of the parameter is different from its expected variation during normal operation of the press when there is no failure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.