Resin composition and article made therefrom
US11618820B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Feb 3, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.