Detect whether die or channel is defective to confirm temperature data
US11621049B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2021 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Oct 7, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system include multiple memory dice and a processing device coupled to the multiple memory dice. The processing device is to perform operations, including: reading temperature values from registers at multiple memory dice, wherein each temperature value is associated with a temperature at a respective die of the multiple memory dice; reading error-correcting code (ECC)-protected data from the multiple memory dice; determining whether an ECC check of the ECC-protected data results in detecting an error; in response to detecting the error from the ECC-protected data for a die of the multiple memory dice, performing a confirmation check that the error is a result of a defect in the die; and in response to the confirmation check confirming the die is defective, ignoring a temperature value from the die when determining whether to trigger a thermal-related operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.