Method for treating substrate
US11621159B2 · kind B2 · utility
1Cited by
0References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 15, 2020 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Sep 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Disclosed is a method of treating a substrate. In one embodiment, supercritical fluid is supplied to a treatment space in a chamber such that the substrate in the treatment space is treated. The supercritical fluid is supplied to the treatment space while exhausting the treatment space. A temperature of the supercritical fluid supplied when exhausting the treatment space is higher than a temperature of the supercritical fluid supplied to the treatment space for treating the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.