Interposer and electronic package

US11621237B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Jonathan W. Thibado · Beaverton, US
• Jeffory L. Smalley · East Olympia, US
• John C. Gulick · Portland, US
• Phi Thanh · Hillsboro, US
• Mohanraj Prabhugoud · Hillsboro, US
• Chong J. Zhao · West Linn, US

Key dates

• Filing date: Jan 14, 2019
• Grant date: Apr 4, 2023
• Expiry date: Aug 4, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1115
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.