Apparatus and method for wet process on semiconductor substrate
US11626297B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2016 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Apr 3, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism (1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.