Multi stack optical elements using temporary and permanent bonding

US11626321B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Ludovic Godet · Sunnyvale, US
• Wayne MCMILLAN · San Jose, US
• Rutger Meyer Timmerman Thijssen · Sunnyvale, US
• Naamah ARGAMAN · San Jose, US
• Tapashree Roy · Kanchinakote, IN
• Sage Toko Garrett DOSHAY · Saratoga, US

Key dates

• Filing date: May 22, 2020
• Grant date: Apr 11, 2023
• Expiry date: Jul 27, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/855
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.