Image sensor package
US11626434B2 · kind B2 · utility
0Cited by
13References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 18, 2021 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Nov 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
Abstract
A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.