Method for transferring light-emitting structures
US11626548B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 17, 2018 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Sep 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for transferring electroluminescent structures onto a face, referred to as the accommodating face, of an accommodating substrate. The accommodating face is moreover provided with interconnections intended to individually address each of the structures. The electroluminescent structures are initially formed on a supporting substrate and are separated by tracks. It is then proposed in the present invention to form reflective walls, vertically above the tracks, which comprise a supporting polymer (the second polymer) supporting a metal film on its sides. Such an arrangement of reflective walls makes it possible to reduce the stresses exerted on the electroluminescent structures during the transfer method according to the present invention. Moreover, the reflective walls, within the meaning of the present invention, may be produced on all the electroluminescent structures resting on a supporting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.