Antenna packaging module and making method thereof
US11626657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Jul 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an antenna packaging module and the making method. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a third packaging layer, and a packaging antenna connector to an external circuit board. The antenna structure includes a connector opening and at least a first antenna structure and a second antenna structure stacked on one surface of the redistribution layer. The packaging antenna connector is designed in the connector opening and is electrically connected to the redistribution layer. Electrical terminals are provided through the packaging antenna connector disposed in the connector opening, thus reducing the antenna signal loss. The antenna packaging module requires neither any metal wire ends electrically connected to redistribution layer, nor a flip-chip process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.