Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad
US11628535B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Sep 26, 2019 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Feb 2, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2110/0066
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polishing pad includes a polyurethane, wherein the polyurethane includes a fluorinated repeating unit represented by Formula 1, wherein the number of defects on a substrate after polishing with the polishing pad and a fumed silica slurry is 40 or less;
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.