Computational metrology based sampling scheme
US11635698B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2018 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | May 25, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F18/24
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for generating metrology sampling scheme for a patterning process, the method including: obtaining a parameter map of a parameter of a patterning process for a substrate; decomposing the parameter map to generate a fingerprint specific to an apparatus of the patterning process and/or a combination of apparatuses of the patterning process; and based on the fingerprint, generating a metrology sampling scheme for a subsequent substrate at the apparatus of the patterning process and/or the combination of apparatuses of the patterning process, wherein the sampling scheme is configured to distribute sampling points on the subsequent substrate so as to improve a metrology sampling density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.