Wiring board and method of manufacturing the same
US11637060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2022 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Mar 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.