Optically clear thermal spreader for status indication within an electronics package
US11637211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Jun 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.