Surface acoustic wave device package and method of manufacturing the same
US11637539B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
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Key dates
| Filing date | Jun 18, 2019 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Jan 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/14502
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.