Eun Tae Park
13Patents
4h-index
30Co-inventors
56Inventor score
Filing activity: Jan 3, 2006 → Oct 30, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7293356B2 | Method of fabricating printed circuit board having embedded multi-layer passive devices | Emerging Cross-Sectional Technologies | 86 | Active |
| US8421609B2 | Haptic feedback device and electronic device having the same | Electricity | 52 | Active |
| US7609504B2 | High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the same | Electricity | 7 | Active |
| US8446663B2 | Electronic paper display device and method for manufacturing the same | Emerging Cross-Sectional Technologies | 4 | Active |
| US10446506B2 | Wafer level package and manufacturing method thereof | Electricity | 3 | Active |
| US7567426B2 | Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein | Electricity | 3 | Active |
| US8093172B2 | Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same | Electricity | 1 | Active |
| US8492954B2 | Ultrasonic sensor | Electricity | 1 | Active |
| US7871482B2 | Method of manufacturing multilayer ceramic substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US10541668B2 | Acoustic resonator and method of manufacturing the same | Electricity | 0 | Active |
| US11909380B2 | Acoustic resonator and method of manufacturing the same | Electricity | 0 | Active |
| US8753462B2 | Method of manufacturing non-shrinking multilayer ceramic substrate | Electricity | 0 | Active |
| US11637539B2 | Surface acoustic wave device package and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.