Pattern-enhanced spatial correlation of test structures to die level responses
US11640160B2 · kind B2 · utility
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Key dates
| Filing date | Aug 6, 2021 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Aug 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Enhancement of less dominant patterns for parametric wafer measurements. Dominant patterns are removed from the parametric pattern thereby revealing a less dominant pattern. The less dominant patterns can be used to identify root causes for yield loss that are not visible in the original parametric measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.