Copper-alloy capping layers for metallization in touch-panel displays
US11640222B2 · kind B2 · utility
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4References
20Claims
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Key dates
| Filing date | Jun 13, 2022 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Jun 13, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.