Porous polyurethane polishing pad and process for preparing the same
US11642752B2 · kind B2 · utility
1Cited by
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6Claims
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Key dates
| Filing date | Sep 10, 2018 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Jul 24, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.