SK ENPULSE CO., LTD.
24Patents
24Active
24Granted
63Portfolio score
Filing activity: Jan 18, 2018 → Apr 26, 2024
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11642752B2 | Porous polyurethane polishing pad and process for preparing the same | Chemistry; Metallurgy | 1 | Active |
| US12076832B2 | Polishing pad with improved crosslinking density and process for preparing the same | Electricity | 0 | Active |
| US12042900B2 | Polishing system, polishing pad and method of manufacturing semiconductor device | Performing Operations; Transporting | 0 | Active |
| US12162114B2 | Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same | Chemistry; Metallurgy | 0 | Active |
| US12136539B1 | Semiconductor device fabrication apparatus | Electricity | 0 | Active |
| US11724391B2 | Method and apparatus for determining status of a robot | Electricity | 0 | Active |
| US12362232B2 | Polishing pad and method for preparing semiconductor device using the same | Electricity | 0 | Active |
| US12276905B2 | Blank mask and photomask using the same | Physics | 0 | Active |
| US12258460B2 | Polishing pad and method of fabricating semiconductor device using the same | Chemistry; Metallurgy | 0 | Active |
| US11772236B2 | Porous polishing pad and process for producing the same all fees | Electricity | 0 | Active |
| US11766759B2 | Porous polyurethane polishing pad and process for producing the same | Electricity | 0 | Active |
| US11724356B2 | Porous polyurethane polishing pad and preparation method thereof | Chemistry; Metallurgy | 0 | Active |
| US11964360B2 | Polishing pad comprising window similar in hardness to polishing layer | Electricity | 0 | Active |
| US11759909B2 | Polishing pad, preparation method thereof and method for preparing semiconductor device using same | Electricity | 0 | Active |
| US12138736B2 | Polishing pad sheet, polishing pad, and method for manufacturing semiconductor device | Chemistry; Metallurgy | 0 | Active |
| US11931856B2 | Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same | Electricity | 0 | Active |
| US11780057B2 | Polishing pad and method for producing same | Electricity | 0 | Active |
| US12110421B2 | Composition for semiconductor processing and method of fabricating semiconductor device using the same | Electricity | 0 | Active |
| US12138738B2 | Polishing pad, preparation method thereof and method for preparing semiconductor device using same | Electricity | 0 | Active |
| US11951591B2 | Polishing pad, method for producing the same and method of fabricating semiconductor device using the same | Performing Operations; Transporting | 0 | Active |
| US12246408B2 | Polishing pad and method of fabricating semiconductor device using the same | Electricity | 0 | Active |
| US12122013B2 | Composition for polishing pad and polishing pad | Chemistry; Metallurgy | 0 | Active |
| US12027395B2 | Method and apparatus for measuring displacement of an end effector | Electricity | 0 | Active |
| US12116503B2 | Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.