Silver/tin electroplating bath and method of using the same
US11643742B2 · kind B2 · utility
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3References
18Claims
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Key dates
| Filing date | Feb 2, 2022 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Feb 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/03
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.