Configurable soft post-package repair (SPPR) schemes
US11646095B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
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Key dates
| Filing date | Mar 6, 2020 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Oct 9, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C29/76
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods to perform multiple row repair mode for soft post-packaging repair of previously repaired data groups are disclosed. The devices may have activation circuitry that includes a mode register bit or a control antifuse that sends an input signal upon activation. The devices may also include a logic element that receives the input signal and sends, upon receiving the input signal, a configuration signal that enables a multiple row repair mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.