Method of cleaning wafer and wafer with reduced impurities
US11646209B2 · kind B2 · utility
0Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Oct 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of cleaning a wafer comprises: a scrubbing operation comprising treating a target wafer to be cleaned with a brush at a rotation rate of 200 rpm or less to prepare a brush cleaned wafer; and a cleaning operation comprising cleaning the brush cleaned wafer with a cleaning solution to prepare a cleaned bare wafer, wherein the cleaning operation comprises a first cleaning operation and a second cleaning operation sequentially.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.