Wafer cleaning apparatus and wafer cleaning method using the same
US11648594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2020 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Nov 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.