Laser processing apparatus, laser processing method, and correction data generation method
US11648629B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2020 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jun 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus is used which includes: a laser oscillator that oscillates a processing laser beam at a processing point to be processed on a surface of a workpiece; an optical interferometer that emits a measurement beam to the processing point and generates an optical interference intensity signal based on interference generated due to an optical path difference between the measurement beam reflected at the processing point and a reference beam; a first mirror that changes traveling directions of the processing laser beam and the measurement beam; a second mirror that changes an incident angle of the measurement beam onto the first mirror; a lens that focuses the processing laser beam and the measurement beam on the processing point; a memory that stores corrected processing data; a control unit that controls the laser oscillator, the first mirror, and the second mirror based on the corrected processing data; and a measurement processing unit that derives a depth of a keyhole generated at the processing point by the processing laser beam, based on the optical interference intensity signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.