Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same
US11649351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2020 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/385
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.