Composite interposer structure and method of providing same
US11652059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Nov 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques and mechanisms for high interconnect density communication with an interposer. In some embodiments, an interposer comprises a substrate and portions disposed thereon, wherein respective inorganic dielectrics of said portions adjoin each other at a material interface, which extends to each of the substrate and a first side of the interposer. A first hardware interface of the interposer spans the material interface at the first side, wherein a first one of said portions comprises first interconnects which couple the first hardware interface to a second hardware interface at the first side. A second one of said portions includes second interconnects which couple one of first hardware interface or the second hardware interface to a third hardware interface at another side of the interposer. In another embodiment, a metallization pitch feature of the first hardware interface is smaller than a corresponding metallization pitch feature of the second hardware interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.