Patent · US Active

Trench capacitor assembly for high capacitance density

US11652101B2 · kind B2 · utility

1Cited by

0References

12Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Jonghae Kim · San Diego, US
Milind Shah · San Diego, US
Periannan Chidambaram · San Diego, US

Key dates

Filing date	Jan 8, 2021
Grant date	May 16, 2023
Priority date	—
Expiry date	Jun 21, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Certain aspects of the present disclosure provide a capacitor assembly, a stacked capacitor assembly, an integrated circuit (IC) assembly comprising such a stacked capacitor assembly, and methods for fabricating the same. One exemplary capacitor assembly generally includes a first array of trench capacitors and a second array of trench capacitors. The second array of trench capacitors may be disposed adjacent to and electrically coupled to the first array of trench capacitors. Additionally, the second array of trench capacitors may be inverted with respect to the first array of trench capacitors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.