Ground member and shielded printed wiring board
US11653439B2 · kind B2 · utility
0Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2019 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Dec 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.